JPH0330459U - - Google Patents
Info
- Publication number
- JPH0330459U JPH0330459U JP9172789U JP9172789U JPH0330459U JP H0330459 U JPH0330459 U JP H0330459U JP 9172789 U JP9172789 U JP 9172789U JP 9172789 U JP9172789 U JP 9172789U JP H0330459 U JPH0330459 U JP H0330459U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- leads
- multilayer printed
- mounting structure
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9172789U JPH0330459U (en]) | 1989-08-02 | 1989-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9172789U JPH0330459U (en]) | 1989-08-02 | 1989-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330459U true JPH0330459U (en]) | 1991-03-26 |
Family
ID=31641197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9172789U Pending JPH0330459U (en]) | 1989-08-02 | 1989-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330459U (en]) |
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1989
- 1989-08-02 JP JP9172789U patent/JPH0330459U/ja active Pending